top of page
N10

N10

Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for Blade and 1U Server. Support 205 Watts CPU Power Heat Dissipation.

 

* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5), DY-PK-4189-P5 Package Carrier needs to purchase separately.

CPU Support

Intel® Ice Lake and Cooper Lake Server Processor

CPU Socket

FCLGA 4189-4/5(Socket P4/P5 or P+ )

Solution

Blade and 1U Server

Dimensions

113 x 78 x 27 mm

Weight

450 g

Material

Copper 1100 for both Vapor Chamber Base and Fin Stack

Thermal Grease

Shin-Etsu 7762 Pre-printed

*All product specifications and product images are subject to change without notice.

 

 

関連商品